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Research & Development

Engineers and IIT professors

The IIT bench and engineers turning coconut shells, sodium-ion cathodes, and hard-carbon anodes into the next generation of Indian batteries — and the firmware, boards, and enclosures that carry them into the field.

Embedded Systems

Firmware and hardware engineers building the intelligence inside every deployed pack.

Balaji
Balaji
Embedded Hardware Engineer

GREEN + GRID: builds the hardware inside every BESS pack — sensor front-ends and comms buses feeding griddata's dispatch layer.

Abhishek
Abhishek
Embedded Hardware Engineer

Designs and validates BMS-adjacent hardware — the interface between LFP cells, the thermal loop, and the pack-level control stack.

Nandha Kumar
Nandha Kumar
Embedded Software Engineer

Writes the firmware that estimates state-of-charge and cell balancing in real time — a Made-in-India replacement for imported BMS stacks.

Karthik RR
Karthik RR
Embedded Software Engineer

Owns the on-device control loop — protocol layers that push telemetry from every deployed pack up into the griddata screen.

Design & PCB

Schematics, layout, routing and IC-package design — turning circuit ideas into manufacturable boards.

Sivasamy
Sivasamy
PCB Route Planner & Designer

Routes the multi-layer boards inside every BMS and inverter interface — signal integrity for cells that must last a 20-year cycle life.

Sathish Kumar
Sathish Kumar
Hardware Schematic Design & PCB Library Creation

Curates the schematic library the entire product suite draws from — one canonical part list across BESS, chargers, and IoT SKUs.

Santhana Bharathi
Santhana Bharathi
Embedded Hardware Design & PCB Design

Bridges schematic-to-layout for the pack electronics — DFM-ready boards that walk straight onto the SIPCOT SMT line.

Karthikeyan
Karthikeyan
PCB Design & Routing

Runs multi-layer high-speed routing for the griddata edge gateways sitting on every substation and cooperative panel.

Rajeshwaran
Rajeshwaran
IC Package Design and Schematic Design

Chip-package integration for the BMS ASIC path — a non-Chinese semiconductor lane across the Indo-Pacific supply chain.

Saravaprakash
Saravaprakash
3D Design and Product Development Engineer

Turns pack, charger, and gateway drawings into manufacturable enclosures — 45 °C ambient tolerant, monsoon salt-spray rated.

Software & Testing

Assembly line, mobile, full-stack and research work that closes the loop between hardware and the user.

Mohana Priya
Mohana Priya
Lead Hardware Assembly Line and Testing

Runs the SMT-and-final-test line inside the 720 MWh factory — every board leaves with a serialised cycle-and-EIS record.

Priyanka Anand
Priyanka Anand
Mobile Apps Developer

Ships the griddata mobile surface — the pane where a cooperative member sees their share of generation, dispatch, and dividend.

Sathya Natrajan
Sathya Natrajan
Full Stack Developer

Owns the griddata backend — Indian tariff engine, GCPP settlement math, and the digital twin that mirrors every deployed pack.

Nishant Kumar
Nishant Kumar
Research Scholar

Prototypes what ships in two years — sodium-ion chemistry variants and next-gen dispatch algorithms feeding into the roadmap.